We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for RF sputtering equipment.
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RF sputtering equipment Product List and Ranking from 4 Manufacturers, Suppliers and Companies

RF sputtering equipment Product List

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RF sputtering device "SP-3400"

RF sputtering device "SP-3400"

Inverted sputtering is also possible! Equipped with a 500W high-frequency power supply, it can deposit metals, oxides, insulators, and more.

The "SP-3400" is an RF sputtering device equipped with three sources for 3-inch cathodes. It features a single 500W high-frequency power supply, enabling the deposition of metals, oxides, insulators, and more. By incorporating two automatic matching units, it allows for reverse sputtering through switching, and it also comes standard with a substrate rotation mechanism to improve the film thickness distribution during deposition. The device uses an operational touch screen, making it easy for beginners to perform automatic operation of the exhaust system, and it is equipped with safety circuits to prevent malfunctions. 【Features】 ■ Three sources for 3-inch cathodes ■ One 500W high-frequency power supply ■ Capable of depositing metals, oxides, insulators, etc. ■ Reverse sputtering is possible by switching with two automatic matching units ■ Standard substrate rotation mechanism to improve film thickness distribution during deposition ■ Operational touch screen for easy automatic operation of the exhaust system, even for beginners *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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RF sputtering device for research and development experiments

RF sputtering device for research and development experiments

Customization according to experimental purposes is possible. Small RF sputtering device.

☆Metal thin films, of course, as well as small RF sputtering devices for the production of insulating films/oxide films☆ Recommended POINT <Customization according to experimental purposes!!> 1. Three types of chambers available to match sample sizes 2. Cathode sizes compatible from 2 to 6 inches 3. The 2-inch cathode type also supports a three-source configuration = Achieving thin film stacking 4. A variety of options available Substrate heating unit / Substrate cooling unit / MFC unit, etc.

  • Coater

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RF sputtering device for research and development experiments

RF sputtering device for research and development experiments

Customizable to fit experimental purposes. Small RF sputtering device.

A compact RF sputtering device compatible with the production of metal films, as well as insulating films/oxide films. 【Features】 ○ Three types of chambers available to match sample sizes 〇 Cathode sizes compatible with 2, 4, and 6 inches 〇 The 2-inch cathode type also supports a three-source configuration ⇒ Enables the production of stacked films 〇 A variety of options available 　　Substrate heating unit / Substrate cooling unit / MFC unit, etc.

  • SVC-700RF?.jpg
  • Sputtering Equipment

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Multi-source RF sputtering device with glove box

Multi-source RF sputtering device with glove box

A research membrane environment that aims to eliminate oxygen and moisture! Supports multilayer membranes, compound membranes, and reactive membranes!

This product is a sputtering device for the development of batteries, catalyst materials, and organic devices. It connects a load lock chamber and a glove box to the sputtering chamber. It can accommodate four UHV-compatible sputter cathodes. Additionally, it supports multilayer films, compound film deposition, and reactive film deposition. 【Features】 ■ For the development of batteries, catalyst materials, and organic devices ■ Connects a load lock chamber and a glove box to the sputtering chamber ■ Can accommodate four UHV-compatible sputter cathodes ■ Research film deposition environment that eliminates oxygen and moisture ■ Supports multilayer films, compound film deposition, and reactive film deposition *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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Parallel Moving 3D RF Sputtering Device 'MSS600-3'

Parallel Moving 3D RF Sputtering Device 'MSS600-3'

Control of sputter pressure is possible with gas introduction and pressure control valves!

The "MSS600-3" is a three-dimensional RF sputtering device using a rectangular cathode measuring W100 x H500mm. The substrate size is W200 x H300mm, and it is deposited while being transported in the X direction. Additionally, the substrate can be set to any time between 30 seconds and 15 hours, allowing for film thickness adjustment and various types of heterogeneous layered film deposition. 【Features】 ■ Automatic sputtering function enables labor-saving long-duration sputtering work. ■ Uses a rectangular cathode manufactured by GenCore, allowing for uniform sputter gas introduction near the target. ■ The process chamber is divided into three rooms with rotating shutters to prevent sputter contamination diffusion. ■ Sputtering is possible while moving the substrate at a constant speed, among other features. *For more details, please download the PDF or feel free to contact us.

  • Vacuum Equipment
  • Sputtering Equipment

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Desktop RF Sputtering Device 'SVC-700RFIII'

Desktop RF Sputtering Device 'SVC-700RFIII'

Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.

The "SVC-700RFIII" is a compact RF magnetron sputtering device that can be placed on a desk, equipped with three φ2-inch cathodes. It is capable of forming stacked films using three types of targets. It can be expanded with a gas introduction mechanism, allowing for the introduction of up to three types of gases, including argon gas. In addition to metal thin films, it can accommodate the production of various thin films such as insulating films, oxides, and nitrides. 【Features】 ■ Desktop size for research and development ■ Sample size: up to φ2 inches ■ Additional film thickness sensor available *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

  • Sputtering Equipment

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4-inch 3-source RF sputtering device

4-inch 3-source RF sputtering device

The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!

This product is a 3-source RF magnetron sputtering system designed for metal and insulating materials. The substrate features a heating mechanism and a reverse sputtering mechanism. The sputter cathodes consist of three φ4-inch magnetron cathodes, and the substrate insertion is designed for manual opening and closing of the top cover. 【Features】 ■ Substrate size: Maximum 3 inches (can accommodate 3 pieces) ■ Substrate holder: Substrate heating up to 500°C, substrate rotation, and reverse sputtering mechanism included ■ Sputter cathodes: Three φ4-inch magnetron cathodes ■ Gas system: Two systems of Ar and O2 MFC ■ Substrate insertion: Manual opening and closing of the top cover *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

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